Journal: Journal of Neural Engineering

Article Title: The geometry of photopolymerized topography influences neurite pathfinding by directing growth cone morphology and migration

doi: 10.1088/1741-2552/ad38dc

Figure Lengend Snippet: Schematic of photopatterning process and pattern characterization. (A) Schematic of photopolymerizing micropatterned substrates. A monomer solution (yellow) is added to a silane coupled glass cover slip (grey). Then the photomask (black outlined pattern) is placed on top of the solution before exposing the system to UV (ultraviolet, 355 nm) light. The monomer polymerizes to form a solid substrate and the photomask is removed. Schematic is representative and not to scale. (B) The photomask (black). This pattern repeats over the photomask to create the topographically micropatterned substrate. (C) A depth, color-coded confocal microscopy image of multi-angled microfeatures patterned in the substrate surface. Scale bars = 100 μ m.

Article Snippet: Then, to create the patterned substrates, this solution was evenly dispersed on a silane-coupled piece of cover glass by placing glass-chrome custom photomask (Applied Image Inc., figure (b)) on top.

Techniques: Confocal Microscopy

Journal: Micromachines

Article Title: Facile Patterning of Thermoplastic Elastomers and Robust Bonding to Glass and Thermoplastics for Microfluidic Cell Culture and Organ-on-Chip

doi: 10.3390/mi12050575

Figure Lengend Snippet: ( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used photomask. A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.

Article Snippet: The SU-8 layer was patterned by exposing the sample through the photomask to ultraviolet (UV) light (ABM Series 60 Exposure Systems; ABM, Inc., New York City, NY, USA), at 21 mW/cm2 for 5 s. The post exposure bake was performed at 65 °C for 5 min followed by a similar temperature ramp as the pre-exposure bake and then baked for an additional 9 min at 95 °C.

Techniques: Comparison